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Lead-Free Solder Bar Sn/Ag3.0/Cu0.5
Description:
Brand
LIAN JING
Model Number
LJ9635B
Composition
Sn/Ag3.0/Cu0.5
Specific Gravity
7.4
Package
20KG /CARTON
Storage
Store in a cool, dry place out of direct sunlight and away from sources of ignition
Melting Point
217℃~218℃
Processing Temperature
255~260℃
Application
This specification applies to tin spraying over PCB and widely applicable to automatic soldering wave machine
DocumentName Click to download T he catalog of LJ9635B Download LJ9635B MSDS Download RoHs 、 Halogen test by SGS for L ead-Free Solder Bar Download SVHC 144 item test by SGS for L ead-Free Solder Bar Download
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