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Lead-Free Solder Bar Sn/Ag3.0/Cu0.5


 
Description:


Brand

LIAN JING

Model Number

LJ9635B

Composition

Sn/Ag3.0/Cu0.5

Specific Gravity

7.4

Package

20KG/CARTON

Storage

Store in a cool, dry place out of direct sunlight and away from sources of ignition

Melting Point

217℃~218℃

Processing Temperature

255~260℃

Application

This specification applies to tin spraying over PCB and widely applicable to automatic soldering wave machine





DocumentNameClick to download
The catalog of  LJ9635BDownload
LJ9635B MSDSDownload
RoHsHalogen test by SGS for Lead-Free Solder BarDownload
SVHC 144 item test by SGS for Lead-Free Solder BarDownload





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