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Lead-Free Solder Bar Sn/Ag0.3/Cu0.7


 
Description:

Brand

LIAN JING

Model Number

LJ9307B

Composition

Sn/Ag0.3/Cu0.7

Specific Gravity

7.3

Package

20KG/CARTON

Storage

Store in a cool, dry place out of direct sunlight and away from sources of ignition

Melting Point

217~227

Processing Temperature

255~260

Application

This specification applies to tin spraying over PCB and widely applicable to automatic soldering wave machine

 

Document  NameClick to download
LJ9307B  MSDSDownload
The catalog of  LJ9307BDownload
RoHsHalogen test by SGS for Lead-Free Solder BarDownload
SVHC 144 item test by SGS for Lead-Free Solder BarDownload





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